LMV324MDC
vs
LMV934IPWG4
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
TEXAS INSTRUMENTS INC
Part Package Code
DIE
TSSOP
Package Description
DIE, DIE OR CHIP
TSSOP, TSSOP14,.25
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.25 µA
0.075 µA
Bias Current-Max (IIB) @25C
0.25 µA
0.065 µA
Common-mode Reject Ratio-Nom
65 dB
81 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
7000 µV
7500 µV
JESD-30 Code
X-XUUC-N
R-PDSO-G14
Low-Bias
NO
NO
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
4
4
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
TSSOP
Package Equivalence Code
DIE OR CHIP
TSSOP14,.25
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Power
NO
NO
Programmable Power
NO
NO
Qualification Status
Not Qualified
Not Qualified
Slew Rate-Nom
1 V/us
0.35 V/us
Supply Current-Max
1.16 mA
0.92 mA
Supply Voltage Limit-Max
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
5 V
1.8 V
Surface Mount
YES
YES
Technology
BICMOS
BICMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
NO LEAD
GULL WING
Terminal Position
UPPER
DUAL
Time@Peak Reflow Temperature-Max (s)
40
30
Unity Gain BW-Nom
1000
1400
Voltage Gain-Min
10000
3980
Wideband
NO
NO
Base Number Matches
2
1
Pin Count
14
JESD-609 Code
e4
Length
5 mm
Number of Terminals
14
Packing Method
TUBE
Seated Height-Max
1.2 mm
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Pitch
0.65 mm
Width
4.4 mm
Compare LMV324MDC with alternatives
Compare LMV934IPWG4 with alternatives