LMC6462BIM/NOPB
vs
LMC6462BIM
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
SOIC-8
SOIC-8
Pin Count
8
8
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.00001 µA
0.00001 µA
Common-mode Reject Ratio-Min
62 dB
62 dB
Common-mode Reject Ratio-Nom
74 dB
74 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
3000 µV
3000 µV
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e0
Length
4.9 mm
4.9 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
YES
YES
Moisture Sensitivity Level
1
1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
RAIL
RAIL
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Slew Rate-Min
0.008 V/us
0.008 V/us
Slew Rate-Nom
0.023 V/us
0.023 V/us
Supply Current-Max
0.07 mA
0.07 mA
Supply Voltage Limit-Max
16 V
16 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
30
Unity Gain BW-Nom
50
50
Width
3.9 mm
3.9 mm
Base Number Matches
2
2
Compare LMC6462BIM/NOPB with alternatives
Compare LMC6462BIM with alternatives