LMC6462BIM
vs
TS27L2BIDT
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOIC-8
|
MICRO, PLASTIC, SO-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.00001 µA
|
0.0003 µA
|
| Common-mode Reject Ratio-Min |
62 dB
|
|
| Common-mode Reject Ratio-Nom |
74 dB
|
80 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
3000 µV
|
3500 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e4
|
| Length |
4.9 mm
|
4.9 mm
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
YES
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
RAIL
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
235
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Slew Rate-Min |
0.008 V/us
|
|
| Slew Rate-Nom |
0.023 V/us
|
0.04 V/us
|
| Supply Current-Max |
0.07 mA
|
0.036 mA
|
| Supply Voltage Limit-Max |
16 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
10 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Unity Gain BW-Nom |
50
|
100
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Voltage Gain-Min |
|
40000
|
| Wideband |
|
NO
|
|
|
|
Compare LMC6462BIM with alternatives
Compare TS27L2BIDT with alternatives