LM3361AM
vs
S1T3361D01-D0B0
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
SOP, SOP16,.25
|
0.300 INCH, DIP-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
AUDIO SINGLE CHIP RECEIVER
|
AUDIO DEMODULATOR
|
Demodulation Type |
FM
|
FM
|
JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
|
Length |
9.9 mm
|
19.4 mm
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
-20 °C
|
Output Voltage-Nom (FM) |
350 mV
|
150 mV
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP16,.25
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
5.08 mm
|
Supply Current-Max |
6 mA
|
8 mA
|
Supply Voltage-Max (Vsup) |
9 V
|
7 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2.5 V
|
Surface Mount |
YES
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Number of Functions |
|
1
|
|
|
|
Compare LM3361AM with alternatives
Compare S1T3361D01-D0B0 with alternatives