S1T3361D01-D0B0 vs MC3361BDR2 feature comparison

S1T3361D01-D0B0 Samsung Semiconductor

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MC3361BDR2 Motorola Mobility LLC

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MOTOROLA INC
Part Package Code DIP SOIC
Package Description 0.300 INCH, DIP-16 SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type AUDIO DEMODULATOR AUDIO SINGLE CHIP RECEIVER
Demodulation Type FM FM
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.4 mm 9.9 mm
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C -30 °C
Output Voltage-Nom (FM) 150 mV 160 mV
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.75 mm
Supply Current-Max 8 mA 6.4 mA
Supply Voltage-Max (Vsup) 7 V 8 V
Supply Voltage-Min (Vsup) 2.5 V 2 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL OTHER
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 3
Rohs Code No
Harmonic Distortion 0.86%
JESD-609 Code e0
Terminal Finish TIN LEAD

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