LM293N
vs
LM393MWC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
ROCHESTER ELECTRONICS LLC
Package Description
DIP-8
DIE,
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Bias Current-Max (IIB) @25C
0.25 µA
Input Offset Voltage-Max
9000 µV
9000 µV
JESD-30 Code
R-PDIP-T8
X-XUUC-N
JESD-609 Code
e0
Number of Functions
2
2
Number of Terminals
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-25 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIE
Package Equivalence Code
DIP8,.3
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
IN-LINE
UNCASED CHIP
Qualification Status
Not Qualified
Response Time-Nom
1400 ns
1300 ns
Supply Current-Max
2.5 mA
Supply Voltage Limit-Max
36 V
36 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Base Number Matches
6
3
Average Bias Current-Max (IIB)
0.4 µA
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Output Type
OPEN-COLLECTOR
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