LM258N vs LM358J feature comparison

LM258N NXP Semiconductors

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LM358J National Semiconductor Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description 0.300 INCH, PLASTIC, DIP-8 DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.3 µA 0.25 µA
Bias Current-Max (IIB) @25C 0.15 µA 0.25 µA
Common-mode Reject Ratio-Nom 85 dB 85 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 7000 µV 7000 µV
JESD-30 Code R-PDIP-T8 R-GDIP-T8
JESD-609 Code e0 e0
Low-Offset NO NO
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Qualification Status Not Qualified Not Qualified
Slew Rate-Nom 0.3 V/us
Supply Current-Max 1.2 mA 2 mA
Supply Voltage Limit-Max 32 V 32 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade OTHER COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 1000 1000
Voltage Gain-Min 25000 25000
Base Number Matches 1 2
Rohs Code No
Common-mode Reject Ratio-Min 65 dB
Seated Height-Max 5.08 mm
Width 7.62 mm

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