LM185-1.2MW8
vs
LM185-1.2MD8
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
DIE, WAFER
|
DIE, DIE OR CHIP
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
JESD-30 Code |
X-XUUC-N
|
X-XUUC-N
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Voltage-Max |
1.247 V
|
1.247 V
|
Output Voltage-Min |
1.223 V
|
1.223 V
|
Output Voltage-Nom |
1.235 V
|
1.235 V
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIE
|
DIE
|
Package Equivalence Code |
WAFER
|
DIE OR CHIP
|
Package Shape |
UNSPECIFIED
|
UNSPECIFIED
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
MIL-STD-883
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temp Coef of Voltage-Max |
150 ppm/°C
|
150 ppm/°C
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UPPER
|
UPPER
|
Trim/Adjustable Output |
NO
|
NO
|
Voltage Tolerance-Max |
0.98%
|
0.98%
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DIE
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|