LE75183AQC
vs
LE75183BQC
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
QFN
QFN
Package Description
HVQCCN,
HVQCCN,
Pin Count
32
32
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-XQCC-N32
S-XQCC-N32
Length
8 mm
8 mm
Number of Functions
1
1
Number of Terminals
32
32
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
HVQCCN
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
TELECOM CIRCUIT
TELECOM CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
8 mm
8 mm
Base Number Matches
1
1
Compare LE75183AQC with alternatives
Compare LE75183BQC with alternatives