LE75183BQC
vs
CPC7695BCTR
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROSEMI CORP
IXYS INTEGRATED CIRCUITS DIVISION
Part Package Code
QFN
SOIC
Package Description
HVQCCN,
SOP, SOP28,.4
Pin Count
32
28
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-XQCC-N32
R-PDSO-G28
Length
8 mm
18 mm
Number of Functions
1
1
Number of Terminals
32
28
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
SOP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
2.438 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
TELECOM CIRCUIT
TELECOM CIRCUIT
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
35
Width
8 mm
7.49 mm
Base Number Matches
3
3
Rohs Code
JESD-609 Code
e3
Package Equivalence Code
SOP28,.4
Supply Current-Max
0.002 mA
Terminal Finish
Matte Tin (Sn)
Compare LE75183BQC with alternatives
Compare CPC7695BCTR with alternatives