LAN7801-V/9JXVAO
vs
LAN7801T-V/9JX
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
SQFN-64
|
SQFN-64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
18 Weeks
|
33 Weeks
|
Address Bus Width |
|
|
Boundary Scan |
YES
|
YES
|
Bus Compatibility |
USB
|
USB
|
Clock Frequency-Max |
125 MHz
|
125 MHz
|
Communication Protocol |
ASYNC, BIT; SYNC, BYTE; ETHERNET
|
ASYNC, BIT; SYNC, BYTE; ETHERNET
|
Data Transfer Rate-Max |
625 MBps
|
625 MBps
|
JESD-30 Code |
S-PQCC-N64
|
S-PQCC-N64
|
Length |
9 mm
|
9 mm
|
Low Power Mode |
YES
|
YES
|
Number of I/O Lines |
12
|
12
|
Number of Serial I/Os |
4
|
4
|
Number of Terminals |
64
|
64
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC64,.35SQ,20
|
LCC64,.35SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Screening Level |
AEC-Q100
|
AEC-Q100
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.1 V
|
1.1 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
9 mm
|
9 mm
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
SERIAL IO/COMMUNICATION CONTROLLER, LAN
|
Base Number Matches |
1
|
1
|
Date Of Intro |
|
2017-06-14
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare LAN7801-V/9JXVAO with alternatives
Compare LAN7801T-V/9JX with alternatives