L7C162DME25
vs
SMDP-65656L45
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LOGIC DEVICES INC
TEMIC SEMICONDUCTORS
Part Package Code
DIP
Package Description
0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-28
Pin Count
28
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
25 ns
45 ns
Additional Feature
AUTOMATIC POWER-DOWN; HIGH IMPEDANCE WRITE
I/O Type
SEPARATE
JESD-30 Code
R-CDIP-T28
R-CDFP-F28
JESD-609 Code
e0
Length
35.56 mm
Memory Density
65536 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
28
28
Number of Words
16384 words
32768 words
Number of Words Code
16000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
16KX4
32KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DFP
Package Equivalence Code
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B (Modified)
MIL-STD-883 Class B
Seated Height-Max
4.953 mm
Standby Current-Max
0.00025 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.075 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
Compare L7C162DME25 with alternatives
Compare SMDP-65656L45 with alternatives