KXPC857TZP100B
vs
TSXPC860MHMZP40B
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
ATMEL GRENOBLE
|
Part Package Code |
BGA
|
BGA
|
Package Description |
23 X 23 MM, PLASTIC, BGA-357
|
,
|
Pin Count |
357
|
357
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
5A991
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
10 MHz
|
40 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B357
|
S-PBGA-B357
|
JESD-609 Code |
e0
|
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
357
|
357
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
220
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Speed |
100 MHz
|
40 MHz
|
Supply Voltage-Max |
3.6 V
|
3.465 V
|
Supply Voltage-Min |
3 V
|
3.135 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
3
|
3
|
Operating Temperature-Max |
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Temperature Grade |
|
MILITARY
|
|
|
|
Compare KXPC857TZP100B with alternatives
Compare TSXPC860MHMZP40B with alternatives