TSXPC860MHMZP40B
vs
XPC860DHCZP33C1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MOTOROLA INC
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
S-XBGA-B357
|
S-PBGA-B357
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
357
|
357
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA357,19X19,50
|
BGA357,19X19,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
3
|
3
|
| Part Package Code |
|
BGA
|
| Package Description |
|
BGA, BGA357,19X19,50
|
| Pin Count |
|
357
|
| ECCN Code |
|
3A991.A.2
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Clock Frequency-Max |
|
33 MHz
|
| External Data Bus Width |
|
32
|
| Length |
|
25 mm
|
| Seated Height-Max |
|
2.05 mm
|
| Speed |
|
33 MHz
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
3 V
|
| Technology |
|
CMOS
|
| Width |
|
25 mm
|
| uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR, RISC
|
|
|
|
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