TSXPC860MHMZP40B
vs
TSPC860MHMG40C
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
THOMSON-CSF SEMICONDUCTORS
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
JESD-30 Code |
S-XBGA-B357
|
S-CBGA-B357
|
JESD-609 Code |
e0
|
|
Number of Terminals |
357
|
357
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA357,19X19,50
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
3
|
2
|
Part Package Code |
|
BGA
|
Package Description |
|
,
|
Pin Count |
|
357
|
ECCN Code |
|
3A991.A.2
|
Address Bus Width |
|
32
|
Bit Size |
|
32
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
40 MHz
|
External Data Bus Width |
|
32
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
YES
|
Low Power Mode |
|
NO
|
Speed |
|
40 MHz
|
Supply Voltage-Max |
|
3.465 V
|
Supply Voltage-Min |
|
3.135 V
|
Technology |
|
CMOS
|
uPs/uCs/Peripheral ICs Type |
|
MICROPROCESSOR
|
|
|
|
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