KU80386SX16 vs KU80C188EC25 feature comparison

KU80386SX16 Intel Corporation

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KU80C188EC25 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code QFP QFP
Package Description BQFP, QFP, SPQFP100,.9SQ
Pin Count 100 100
Reach Compliance Code unknown compliant
Additional Feature CONTROL ROM; BARREL SHIFTER
Address Bus Width 24 20
Bit Size 32 16
Boundary Scan NO NO
Clock Frequency-Max 32 MHz 50 MHz
External Data Bus Width 16 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G100 S-PQFP-G100
Length 19.05 mm 19.05 mm
Low Power Mode NO YES
Number of DMA Channels
Number of External Interrupts 2
Number of Serial I/Os
Number of Terminals 100 100
On Chip Data RAM Width
Operating Temperature-Max 100 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BQFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, BUMPER FLATPACK
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 4.57 mm 4.57 mm
Speed 16 MHz 25 MHz
Supply Current-Max 220 mA 125 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.635 mm
Terminal Position QUAD QUAD
Width 19.05 mm 19.05 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 2 3
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 4
Package Equivalence Code SPQFP100,.9SQ
Peak Reflow Temperature (Cel) 220
Power Supplies 5 V
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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