KU80C188EC25
vs
SB80C188EC20
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
QFP, SPQFP100,.9SQ
|
LFQFP, QFP100,.63SQ,20
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
compliant
|
unknown
|
| Address Bus Width |
20
|
20
|
| Bit Size |
16
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
50 MHz
|
40 MHz
|
| External Data Bus Width |
8
|
8
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.05 mm
|
14 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
4
|
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
LFQFP
|
| Package Equivalence Code |
SPQFP100,.9SQ
|
QFP100,.63SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
220
|
NOT SPECIFIED
|
| Power Supplies |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
1.66 mm
|
| Speed |
25 MHz
|
20 MHz
|
| Supply Current-Max |
125 mA
|
100 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.635 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
19.05 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare KU80C188EC25 with alternatives
Compare SB80C188EC20 with alternatives