KU80386SX-20
vs
IDT79R3041-25PFG
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
BQFP,
|
CAVITY UP, GREEN, TQFP-100
|
Pin Count |
100
|
100
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
24
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
20 MHz
|
50 MHz
|
External Data Bus Width |
16
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
Length |
19.05 mm
|
14 mm
|
Low Power Mode |
NO
|
NO
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
100 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BQFP
|
LFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, BUMPER
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
1.6 mm
|
Speed |
20 MHz
|
25 MHz
|
Supply Voltage-Max |
5.5 V
|
5.25 V
|
Supply Voltage-Min |
4.5 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CHMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
19.05 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
ECCN Code |
|
3A991.A.2
|
Additional Feature |
|
BURST BUS; 5 PIPELINE STAGES
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Terminal Finish |
|
Matte Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare KU80386SX-20 with alternatives
Compare IDT79R3041-25PFG with alternatives