KU80386SX-20 vs IDT79R3041-25PFG feature comparison

KU80386SX-20 Intel Corporation

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IDT79R3041-25PFG Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description BQFP, CAVITY UP, GREEN, TQFP-100
Pin Count 100 100
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 24 32
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 20 MHz 50 MHz
External Data Bus Width 16 32
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G100 S-PQFP-G100
Length 19.05 mm 14 mm
Low Power Mode NO NO
Number of Terminals 100 100
Operating Temperature-Max 100 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BQFP LFQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, BUMPER FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 1.6 mm
Speed 20 MHz 25 MHz
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CHMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.5 mm
Terminal Position QUAD QUAD
Width 19.05 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 1
Rohs Code Yes
ECCN Code 3A991.A.2
Additional Feature BURST BUS; 5 PIPELINE STAGES
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare KU80386SX-20 with alternatives

Compare IDT79R3041-25PFG with alternatives