KU80386SX-20 vs 79RV308120PF feature comparison

KU80386SX-20 Intel Corporation

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79RV308120PF Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description BQFP, LQFP, QFP100,.63SQ,20
Pin Count 100 100
Reach Compliance Code unknown not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 24 32
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 20 MHz 50 MHz
External Data Bus Width 16 32
Format FIXED POINT FLOATING POINT
Integrated Cache NO YES
JESD-30 Code S-PQFP-G100 R-PQFP-G100
Length 19.05 mm 20 mm
Low Power Mode NO YES
Number of Terminals 100 100
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BQFP LQFP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, BUMPER FLATPACK, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 1.6 mm
Speed 20 MHz 20 MHz
Supply Voltage-Max 5.5 V 3.465 V
Supply Voltage-Min 4.5 V 3.135 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CHMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position QUAD QUAD
Width 19.05 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
ECCN Code 3A991.A.2
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code QFP100,.63SQ,20
Peak Reflow Temperature (Cel) 240
Supply Current-Max 375 mA
Terminal Finish Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s) 20

Compare KU80386SX-20 with alternatives

Compare 79RV308120PF with alternatives