KM75C04AP-35
vs
LH5499U-20
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SHARP CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
0.450 INCH, PLASTIC, LCC-32
|
| Pin Count |
28
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| Access Time-Max |
35 ns
|
20 ns
|
| Additional Feature |
RETRANSMIT
|
RETRANSMIT
|
| Cycle Time |
25 ns
|
30 ns
|
| JESD-30 Code |
R-PDIP-T28
|
R-PQCC-J32
|
| Length |
37.1 mm
|
13.97 mm
|
| Memory Density |
36864 bit
|
36864 bit
|
| Memory Width |
9
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
32
|
| Number of Words |
4096 words
|
4096 words
|
| Number of Words Code |
4000
|
4000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
4KX9
|
4KX9
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
3.56 mm
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
15.24 mm
|
11.43 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Output Characteristics |
|
3-STATE
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare KM75C04AP-35 with alternatives
Compare LH5499U-20 with alternatives