KM75C04AP-35
vs
IDT7204S65TCB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
DIP,
0.300 INCH, THIN, SIDE BRAZED, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
35 ns
65 ns
Additional Feature
RETRANSMIT
RETRANSMIT
Cycle Time
25 ns
80 ns
JESD-30 Code
R-PDIP-T28
R-CDIP-T28
Length
37.1 mm
35.56 mm
Memory Density
36864 bit
36864 bit
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
4KX9
4KX9
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Clock Frequency-Max (fCLK)
12.5 MHz
JESD-609 Code
e0
Memory IC Type
OTHER FIFO
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.3
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.012 A
Supply Current-Max
0.15 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Terminal Finish
TIN LEAD
Compare KM75C04AP-35 with alternatives
Compare IDT7204S65TCB with alternatives