KM68FS1000ZI-10
vs
IS62UR1288SL-70BI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
VFBGA,
MINI, BGA-36
Pin Count
48
36
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
100 ns
70 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B36
Length
8 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
36
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX8
128KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.81 mm
Supply Voltage-Max (Vsup)
3.3 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Moisture Sensitivity Level
3
Supply Voltage-Nom (Vsup)
2.5 V
Terminal Finish
TIN LEAD
Compare KM68FS1000ZI-10 with alternatives
Compare IS62UR1288SL-70BI with alternatives