KM681000BLP55 vs BS62LV1027PCG55 feature comparison

KM681000BLP55 Samsung Semiconductor

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BS62LV1027PCG55 Brilliance Semiconductor Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC BRILLIANCE SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP32,.6
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-PDIP-T32 R-PDIP-T32
Length 41.91 mm 41.91 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX8 128KX8
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Standby Voltage-Min 2 V 1.5 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
I/O Type COMMON
Moisture Sensitivity Level 3
Output Characteristics 3-STATE
Package Equivalence Code DIP32,.6
Peak Reflow Temperature (Cel) 260
Standby Current-Max 2e-7 A
Supply Current-Max 0.046 mA

Compare KM681000BLP55 with alternatives

Compare BS62LV1027PCG55 with alternatives