KM23C4100BG-12 vs UM23C4100M-120 feature comparison

KM23C4100BG-12 Samsung Semiconductor

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UM23C4100M-120 United Microelectronics Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC UNITED MICROELECTRONICS CORP
Part Package Code SOIC
Package Description SOP, SOP40,.56 ,
Pin Count 40
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 120 ns 120 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G40 R-PDSO-G40
JESD-609 Code e0
Length 26.2 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256K16 256K16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP40,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.06 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 10.67 mm
Base Number Matches 1 1

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Compare UM23C4100M-120 with alternatives