KM23C4000HG-15 vs ICS2125MLF feature comparison

KM23C4000HG-15 Samsung Semiconductor

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ICS2125MLF Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code SOIC SOIC
Package Description SOP, SOP32,.56 SOP-32
Pin Count 32 32
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 150 ns
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0 e3
Length 20.47 mm 20.4216 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX8 512KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP32,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm 2.8194 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 11.43 mm 7.3406 mm
Base Number Matches 1 1

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