KM23C2100HFP-15 vs KM23C4100HFP2-10 feature comparison

KM23C2100HFP-15 Samsung Semiconductor

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KM23C4100HFP2-10 Samsung Semiconductor

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Part Package Code QFP QFP
Package Description WQFP, TQFP44,.6SQ,32 WQFP, TQFP44,.6SQ,32
Pin Count 44 44
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 100 ns
Alternate Memory Width 8 8
JESD-30 Code S-CQFP-G44 S-CQFP-G44
JESD-609 Code e0 e0
Length 10 mm 10 mm
Memory Density 2097152 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX16 256K16
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code WQFP WQFP
Package Equivalence Code TQFP44,.6SQ,32 TQFP44,.6SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, WINDOW FLATPACK, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.00005 A 0.0001 A
Supply Current-Max 0.05 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 10 mm 10 mm
Base Number Matches 1 1

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