KFH1G16D2M-DEB50
vs
NAND01GR4B2BZA1F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
VFBGA,
9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-63
Pin Count
63
63
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
76 ns
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
Length
12 mm
12 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-30 °C
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
1.8 V
Qualification Status
Not Qualified
Seated Height-Max
1 mm
1.05 mm
Supply Voltage-Max (Vsup)
2.9 V
1.95 V
Supply Voltage-Min (Vsup)
2.4 V
1.7 V
Supply Voltage-Nom (Vsup)
2.65 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
9.5 mm
9.5 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e1
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
30
Compare KFH1G16D2M-DEB50 with alternatives
Compare NAND01GR4B2BZA1F with alternatives