K9F2G08U0M-YCB0
vs
HY27UF082G2M-TCS
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SK HYNIX INC
|
Package Description |
TSSOP, TSSOP48,.8,20
|
TSOP1, TSSOP48,.8,20
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
30 ns
|
30 ns
|
Command User Interface |
YES
|
YES
|
Data Polling |
NO
|
NO
|
JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
JESD-609 Code |
e0
|
|
Memory Density |
2147483648 bit
|
2147483648 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
|
Number of Sectors/Size |
2K
|
2K
|
Number of Terminals |
48
|
48
|
Number of Words |
268435456 words
|
268435456 words
|
Number of Words Code |
256000000
|
256000000
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
256MX8
|
256MX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSOP1
|
Package Equivalence Code |
TSSOP48,.8,20
|
TSSOP48,.8,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE
|
Page Size |
2K words
|
2K words
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
240
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
YES
|
Sector Size |
128K
|
128K
|
Standby Current-Max |
0.00005 A
|
0.00005 A
|
Supply Current-Max |
0.03 mA
|
0.03 mA
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Toggle Bit |
NO
|
NO
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
TSOP1
|
Pin Count |
|
48
|
Additional Feature |
|
CONTAINS ADDITIONAL 512M BIT SPARE MEMORY
|
Length |
|
18.4 mm
|
Number of Functions |
|
1
|
Operating Mode |
|
ASYNCHRONOUS
|
Programming Voltage |
|
3.3 V
|
Seated Height-Max |
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
|
3.3 V
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Type |
|
SLC NAND TYPE
|
Width |
|
12 mm
|
|
|
|
Compare K9F2G08U0M-YCB0 with alternatives
Compare HY27UF082G2M-TCS with alternatives