K9F2G08U0M-YCB0 vs MT29F2G16AABWPXXXXET feature comparison

K9F2G08U0M-YCB0 Samsung Semiconductor

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MT29F2G16AABWPXXXXET Micron Technology Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC MICRON TECHNOLOGY INC
Package Description TSSOP, TSSOP48,.8,20 TSOP1,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 30 ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0 e3
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type FLASH FLASH
Memory Width 8 16
Moisture Sensitivity Level 3
Number of Sectors/Size 2K
Number of Terminals 48 48
Number of Words 268435456 words 134217728 words
Number of Words Code 256000000 128000000
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256MX8 128MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Page Size 2K words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Sector Size 128K
Standby Current-Max 0.00005 A
Supply Current-Max 0.03 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Toggle Bit NO
Base Number Matches 1 1
Part Package Code TSOP1
Pin Count 48
Length 18.4 mm
Number of Functions 1
Operating Mode ASYNCHRONOUS
Programming Voltage 2.7 V
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Type SLC NAND TYPE
Width 12 mm

Compare K9F2G08U0M-YCB0 with alternatives

Compare MT29F2G16AABWPXXXXET with alternatives