Memory
HY27UF082G2M-TCS
SK Hynix Inc
Description: Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48

Overview of HY27UF082G2M-TCS by SK Hynix Inc

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Part Data Attributes for HY27UF082G2M-TCS by SK Hynix Inc

HY27UF082G2M-TCS
SK Hynix Inc
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SK HYNIX INC
Part Package Code
TSOP1
Package Description
TSOP1, TSSOP48,.8,20
Pin Count
48
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
30 ns
Additional Feature
CONTAINS ADDITIONAL 512M BIT SPARE MEMORY
Command User Interface
YES
Data Polling
NO
JESD-30 Code
R-PDSO-G48
Length
18.4 mm
Memory Density
2147483648 bit
Memory IC Type
FLASH
Memory Width
8
Number of Functions
1
Number of Sectors/Size
2K
Number of Terminals
48
Number of Words
268435456 words
Number of Words Code
256000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
256MX8
Package Body Material
PLASTIC/EPOXY
Package Code
TSOP1
Package Equivalence Code
TSSOP48,.8,20
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
Page Size
2K words
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3.3 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
Sector Size
128K
Standby Current-Max
0.00005 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Toggle Bit
NO
Type
SLC NAND TYPE
Width
12 mm
Want to compare parts?
  1. HY27UF082G2M-TCS
    SK Hynix Inc
    Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48
    VS

Alternate Parts for HY27UF082G2M-TCS

This table gives cross-reference parts and alternative options found for HY27UF082G2M-TCS. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HY27UF082G2M-TCS, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
HY27UF082G2M-TPCP Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48 SK Hynix Inc HY27UF082G2M-TCS vs HY27UF082G2M-TPCP
K9F2G08U0M-YCB00 Flash, 256MX8, 20ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 Samsung Semiconductor HY27UF082G2M-TCS vs K9F2G08U0M-YCB00
K9F2G08U0M-PCB0 Flash, 256MX8, 30ns, PDSO48 Samsung Semiconductor HY27UF082G2M-TCS vs K9F2G08U0M-PCB0
HY27UF082G2M-TPCS Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48 SK Hynix Inc HY27UF082G2M-TCS vs HY27UF082G2M-TPCS
K9F2G08U0M-YCB0T Flash, 256MX8, 30ns, PDSO48 Samsung Semiconductor HY27UF082G2M-TCS vs K9F2G08U0M-YCB0T
K9F2G08U0M-YCB0 Flash, 256MX8, 30ns, PDSO48 Samsung Semiconductor HY27UF082G2M-TCS vs K9F2G08U0M-YCB0
HY27UF082G2M-TPCB Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48 SK Hynix Inc HY27UF082G2M-TCS vs HY27UF082G2M-TPCB
K9F2G08U0M-PCB0T Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Samsung Semiconductor HY27UF082G2M-TCS vs K9F2G08U0M-PCB0T
K9F2G08U0M-PCB00 Flash, 256MX8, 20ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Samsung Semiconductor HY27UF082G2M-TCS vs K9F2G08U0M-PCB00
Part Number Description Manufacturer Compare
MT29F2G16AABWPXXXXET Flash, 128MX16, PDSO48, LEAD FREE, TSOP1-48 Micron Technology Inc HY27UF082G2M-TCS vs MT29F2G16AABWPXXXXET
NAND02GW3B2AN1F Flash, 256MX8, PDSO48, 12 X 20 MM, ROHS COMPLIANT, PLASTIC, TSOP-48 Micron Technology Inc HY27UF082G2M-TCS vs NAND02GW3B2AN1F
MT29F2G08BACWPQS:C Flash, 256MX8, 18ns, PDSO48, LEAD FREE, TSOP1-48 Micron Technology Inc HY27UF082G2M-TCS vs MT29F2G08BACWPQS:C
NAND02GR4B2AN6F 128MX16 FLASH 1.8V PROM, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 STMicroelectronics HY27UF082G2M-TCS vs NAND02GR4B2AN6F
NAND02GW4B2AN1F Flash, 128MX16, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 Numonyx Memory Solutions HY27UF082G2M-TCS vs NAND02GW4B2AN1F
NAND02GW4B2BN1T 128MX16 FLASH 3V PROM, 35ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 STMicroelectronics HY27UF082G2M-TCS vs NAND02GW4B2BN1T
HY27UG162G2M-SPIB Flash, 128MX16, 30ns, PDSO48, 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, USOP1-48 SK Hynix Inc HY27UF082G2M-TCS vs HY27UG162G2M-SPIB
HY27SG082G2M-SCS Flash, 256MX8, 30ns, PDSO48, 12 X 17 MM, 0.65 MM HEIGHT, USOP1-48 SK Hynix Inc HY27UF082G2M-TCS vs HY27SG082G2M-SCS
MT29F2G08FACWPETMS:C Flash, 256MX8, 18ns, PDSO48, LEAD FREE, TSOP1-48 Micron Technology Inc HY27UF082G2M-TCS vs MT29F2G08FACWPETMS:C
HY27UF082G2M-TPCP Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, TSOP1-48 SK Hynix Inc HY27UF082G2M-TCS vs HY27UF082G2M-TPCP

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