K7B401825A-TC65
vs
CY7C1143KV18-400BZC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
BGA
Package Description
LQFP,
13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Pin Count
100
165
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
0.45 ns
Additional Feature
SELF-TIMED WRITE CYCLE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PQFP-G100
R-PBGA-B165
Length
20 mm
15 mm
Memory Density
4718592 bit
18874368 bit
Memory IC Type
CACHE SRAM
QDR SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
100
165
Number of Words
262144 words
1048576 words
Number of Words Code
256000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX18
1MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.6 V
1.9 V
Supply Voltage-Min (Vsup)
3.135 V
1.7 V
Supply Voltage-Nom (Vsup)
3.3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1 mm
Terminal Position
QUAD
BOTTOM
Width
14 mm
13 mm
Base Number Matches
1
1
Rohs Code
Clock Frequency-Max (fCLK)
400 MHz
I/O Type
SEPARATE
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Standby Current-Max
0.29 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.61 mA
Compare K7B401825A-TC65 with alternatives
Compare CY7C1143KV18-400BZC with alternatives