K7B401825A-TC65
vs
CY7C1372AV25-100BGC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
BGA
Package Description
LQFP,
14 X 22 MM, 2.40 MM HEIGHT, FBGA-119
Pin Count
100
119
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
6.5 ns
5 ns
Additional Feature
SELF-TIMED WRITE CYCLE
JESD-30 Code
R-PQFP-G100
R-PBGA-B119
Length
20 mm
22 mm
Memory Density
4718592 bit
18874368 bit
Memory IC Type
CACHE SRAM
ZBT SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
100
119
Number of Words
262144 words
1048576 words
Number of Words Code
256000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX18
1MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
2.4 mm
Supply Voltage-Max (Vsup)
3.6 V
2.625 V
Supply Voltage-Min (Vsup)
3.135 V
2.375 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
QUAD
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
JESD-609 Code
e0
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
BGA119,7X17,50
Peak Reflow Temperature (Cel)
220
Standby Current-Max
0.03 A
Standby Voltage-Min
2.38 V
Supply Current-Max
0.25 mA
Terminal Finish
TIN LEAD
Compare K7B401825A-TC65 with alternatives
Compare CY7C1372AV25-100BGC with alternatives