CY7C1143KV18-400BZC
vs
UPD44164364F5-E30-EQ1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
RENESAS ELECTRONICS CORP
Part Package Code
BGA
Package Description
13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Pin Count
165
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.27 ns
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
400 MHz
333 MHz
I/O Type
SEPARATE
COMMON
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
15 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
QDR SRAM
STANDARD SRAM
Memory Width
18
36
Number of Functions
1
Number of Terminals
165
165
Number of Words
1048576 words
524288 words
Number of Words Code
1000000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
1MX18
512KX36
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
BGA
Package Equivalence Code
BGA165,11X15,40
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
Standby Current-Max
0.29 A
0.265 A
Standby Voltage-Min
1.7 V
1.7 V
Supply Current-Max
0.61 mA
0.52 mA
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
Base Number Matches
1
2
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