K7A403644A-TC15
vs
MCM69F817ZP7
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
MOTOROLA INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
LQFP,
|
BGA,
|
| Pin Count |
100
|
119
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
7 ns
|
| JESD-30 Code |
|
R-PBGA-B119
|
| JESD-609 Code |
|
e0
|
| Length |
|
22 mm
|
| Memory Density |
|
4718592 bit
|
| Memory IC Type |
|
CACHE SRAM
|
| Memory Width |
|
18
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Number of Terminals |
|
119
|
| Number of Words |
|
262144 words
|
| Number of Words Code |
|
256000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
256KX18
|
| Output Characteristics |
|
3-STATE
|
| Output Enable |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
2.4 mm
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
MOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
14 mm
|
|
|
|
Compare K7A403644A-TC15 with alternatives
Compare MCM69F817ZP7 with alternatives