MCM69F817ZP7 vs CY7C1324H-100AXC feature comparison

MCM69F817ZP7 Freescale Semiconductor

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CY7C1324H-100AXC Cypress Semiconductor

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS CYPRESS SEMICONDUCTOR CORP
Package Description BGA, BGA119,7X17,50 LQFP,
Reach Compliance Code unknown compliant
Access Time-Max 7 ns 8 ns
Clock Frequency-Max (fCLK) 117 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PQFP-G100
JESD-609 Code e0 e4
Memory Density 4718592 bit 2359296 bit
Memory IC Type STANDARD SRAM CACHE SRAM
Memory Width 18 18
Number of Terminals 119 100
Number of Words 262144 words 131072 words
Number of Words Code 256000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX18 128KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LQFP
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Power Supplies 3.3 V
Qualification Status Not Qualified Not Qualified
Standby Voltage-Min 3.14 V
Supply Current-Max 0.325 mA
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position BOTTOM QUAD
Base Number Matches 3 1
Pbfree Code Yes
Part Package Code QFP
Pin Count 100
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Additional Feature FLOW-THROUGH ARCHITECTURE
Length 20 mm
Moisture Sensitivity Level 3
Number of Functions 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3.135 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm

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