K7A403644A-TC15
vs
IS61QDP2B21M36A-300B4I
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
INTEGRATED SILICON SOLUTION INC
|
Part Package Code |
QFP
|
BGA
|
Package Description |
LQFP,
|
LBGA, BGA165,11X15,40
|
Pin Count |
100
|
165
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Access Time-Max |
|
0.45 ns
|
Additional Feature |
|
PIPELINED ARCHITECTURE
|
Clock Frequency-Max (fCLK) |
|
300 MHz
|
I/O Type |
|
SEPARATE
|
JESD-30 Code |
|
R-PBGA-B165
|
Length |
|
15 mm
|
Memory Density |
|
37748736 bit
|
Memory IC Type |
|
QDR SRAM
|
Memory Width |
|
36
|
Number of Functions |
|
1
|
Number of Terminals |
|
165
|
Number of Words |
|
1048576 words
|
Number of Words Code |
|
1000000
|
Operating Mode |
|
SYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
1MX36
|
Output Characteristics |
|
3-STATE
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
LBGA
|
Package Equivalence Code |
|
BGA165,11X15,40
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial |
|
PARALLEL
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1.4 mm
|
Standby Current-Max |
|
0.28 A
|
Standby Voltage-Min |
|
1.7 V
|
Supply Current-Max |
|
1.1 mA
|
Supply Voltage-Max (Vsup) |
|
1.89 V
|
Supply Voltage-Min (Vsup) |
|
1.71 V
|
Supply Voltage-Nom (Vsup) |
|
1.8 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
13 mm
|
|
|
|
Compare K7A403644A-TC15 with alternatives
Compare IS61QDP2B21M36A-300B4I with alternatives