K4T1G084QC-ZLD50
vs
K4T1G084QC-ZLD5
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SAMSUNG SEMICONDUCTOR INC
|
Package Description |
FBGA, BGA60,9X11,32
|
FBGA, BGA60,9X11,32
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.32
|
8542.32.00.32
|
Access Time-Max |
0.5 ns
|
0.5 ns
|
Clock Frequency-Max (fCLK) |
267 MHz
|
267 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
4,8
|
4,8
|
JESD-30 Code |
R-PBGA-B60
|
R-PBGA-B60
|
JESD-609 Code |
e1
|
e1
|
Memory Density |
1073741824 bit
|
1073741824 bit
|
Memory IC Type |
DDR2 DRAM
|
DDR2 DRAM
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
60
|
60
|
Number of Words |
134217728 words
|
134217728 words
|
Number of Words Code |
128000000
|
128000000
|
Organization |
128MX8
|
128MX8
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
FBGA
|
Package Equivalence Code |
BGA60,9X11,32
|
BGA60,9X11,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
8192
|
8192
|
Sequential Burst Length |
4,8
|
4,8
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
1
|
3
|
|
|
|
Compare K4T1G084QC-ZLD50 with alternatives
Compare K4T1G084QC-ZLD5 with alternatives