K3N6U1000C-TE15 vs KM23C32005BG-12 feature comparison

K3N6U1000C-TE15 Samsung Semiconductor

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KM23C32005BG-12 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP2 SOIC
Package Description TSOP2, SOP, SOP44,.63
Pin Count 44 44
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 120 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
Length 18.41 mm 28.5 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -20 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 3.1 mm
Supply Current-Max 0.04 mA 0.15 mA
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 1.27 mm
Terminal Position DUAL DUAL
Width 10.16 mm 12.6 mm
Base Number Matches 1 1
Rohs Code No
Additional Feature TTL COMPATIBLE I/O
JESD-609 Code e0
Package Equivalence Code SOP44,.63
Standby Current-Max 0.00005 A
Terminal Finish TIN LEAD

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Compare KM23C32005BG-12 with alternatives