JM38510/10901BPA vs LMC555J/883 feature comparison

JM38510/10901BPA National Semiconductor Corporation

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LMC555J/883 Texas Instruments

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Package Description CERDIP-8 CERAMIC, DIP-8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type PULSE; RECTANGULAR PULSE
JESD-30 Code R-GDIP-T8 R-GDIP-T8
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 MIL-STD-883
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 16 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Part Package Code DIP
Pin Count 8
Output Frequency-Max 3 MHz

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