JANTX1N5811URS
vs
JANS1N5811US
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED, GLASS, MELF-2
HERMETIC SEALED, GLASS, MELF-2
Reach Compliance Code
compliant
compliant
Factory Lead Time
24 Weeks
39 Weeks
Additional Feature
HIGH RELIABILITY, METALLURGICALLY BONDED
HIGH RELIABILITY, METALLURGICALLY BONDED
Application
ULTRA FAST RECOVERY
ULTRA FAST RECOVERY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e0
e0
Non-rep Pk Forward Current-Max
125 A
125 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Output Current-Max
3 A
3 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Qualified
Qualified
Reference Standard
MIL-19500
MIL-19500
Rep Pk Reverse Voltage-Max
150 V
150 V
Reverse Recovery Time-Max
0.03 µs
0.03 µs
Surface Mount
YES
YES
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
1
2
Samacsys Manufacturer
Microchip
Power Dissipation-Max
5 W
Compare JANTX1N5811URS with alternatives
Compare JANS1N5811US with alternatives