JANS1N6152 vs 3Z20 feature comparison

JANS1N6152 Semtech Corporation

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3Z20 Toshiba America Electronic Components

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SEMTECH CORP TOSHIBA CORP
Package Description HERMETIC SEALED PACKAGE-2 O-PALF-W2
Pin Count 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Additional Feature METALLURGICALLY BONDED
Breakdown Voltage-Min 24.3 V
Breakdown Voltage-Nom 27 V
Case Connection ISOLATED ISOLATED
Clamping Voltage-Max 39.2 V
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code O-XALF-W2 O-PALF-W2
JESD-609 Code e0 e0
Non-rep Peak Rev Power Dis-Max 1500 W 1500 W
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 7.5 W 3 W
Qualification Status Qualified Not Qualified
Reference Standard MIL-19500/516
Rep Pk Reverse Voltage-Max 20.6 V
Surface Mount NO NO
Technology ZENER AVALANCHE
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 5 4
Rohs Code No
Dynamic Impedance-Max 30 Ω
JEDEC-95 Code DO-201AD
Operating Temperature-Max 150 °C
Operating Temperature-Min -40 °C
Reference Voltage-Nom 20 V
Reverse Current-Max 10 µA
Voltage Tol-Max 10%
Working Test Current 10 mA

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