JANKCA1N5711
vs
1N5711
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MICROSEMI CORP
|
BROADCOM INC
|
| Part Package Code |
DIE
|
|
| Package Description |
DIE-2
|
GLASS PACKAGE-2
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.40
|
8541.10.00.70
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
CATHODE
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.41 V
|
0.41 V
|
| JESD-30 Code |
S-XUUC-N2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
100 °C
|
200 °C
|
| Output Current-Max |
0.033 A
|
0.015 A
|
| Package Body Material |
UNSPECIFIED
|
GLASS
|
| Package Shape |
SQUARE
|
ROUND
|
| Package Style |
UNCASED CHIP
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
70 V
|
70 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
UPPER
|
AXIAL
|
| Base Number Matches |
1
|
3
|
| Samacsys Manufacturer |
|
Avago Technologies
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Min |
|
-65 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare JANKCA1N5711 with alternatives
Compare 1N5711 with alternatives