1N5711 vs 1N5711E3 feature comparison

1N5711 TE Connectivity

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1N5711E3 Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer TYCO ELECTRONICS M/A-COM MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS PACKAGE-2 HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.70 8541.10.00.70
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e0
Number of Elements 1 1
Number of Phases 1 1
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Output Current-Max 0.075 A 0.033 A
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Power Dissipation-Max 0.25 W
Qualification Status Not Qualified
Rep Pk Reverse Voltage-Max 70 V
Surface Mount NO NO
Technology SCHOTTKY SCHOTTKY
Terminal Finish TIN LEAD
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Base Number Matches 40 2
Additional Feature METALLURGICALLY BONDED
Application GENERAL PURPOSE
JEDEC-95 Code DO-35

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Compare 1N5711E3 with alternatives