JANHCA1N5822
vs
JANTXV1N5822
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Part Package Code |
DIE
|
|
Pin Count |
2
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.40
|
8541.10.00.80
|
Samacsys Manufacturer |
Microsemi Corporation
|
Microsemi Corporation
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
CATHODE
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
S-XXUC-N2
|
O-XALF-W2
|
JESD-609 Code |
e0
|
e0
|
Non-rep Pk Forward Current-Max |
80 A
|
80 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
3 A
|
3 A
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
SQUARE
|
ROUND
|
Package Style |
UNCASED CHIP
|
LONG FORM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Technology |
SCHOTTKY
|
SCHOTTKY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
WIRE
|
Terminal Position |
UNSPECIFIED
|
AXIAL
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Package Description |
|
HERMETIC SEALED PACKAGE-2
|
Additional Feature |
|
METALLURGICALLY BONDED
|
Reference Standard |
|
MIL-19500/620E
|
Rep Pk Reverse Voltage-Max |
|
40 V
|
|
|
|
Compare JANHCA1N5822 with alternatives
Compare JANTXV1N5822 with alternatives