JANHCA1N5299 vs MS1N5299 feature comparison

JANHCA1N5299 Compensated Devices Inc

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MS1N5299 Microsemi Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer COMPENSATED DEVICES INC MICROSEMI CORP
Package Description HERMETIC SEALED, DIE-2 O-LALF-W2
Reach Compliance Code unknown unknown
Case Connection CATHODE ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type CURRENT REGULATOR DIODE CURRENT REGULATOR DIODE
JESD-30 Code S-XXUC-N2 O-LALF-W2
Limiting Voltage-Max 1.45 V 1.45 V
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material UNSPECIFIED GLASS
Package Shape SQUARE ROUND
Package Style UNCASED CHIP LONG FORM
Power Dissipation-Max 0.5 W 0.475 W
Qualification Status Not Qualified Not Qualified
Reference Standard MIL-19500/463G
Regulation Current-Nom (Ireg) 1.2 mA 1.2 mA
Rep Pk Reverse Voltage-Max 100 V 100 V
Surface Mount YES NO
Technology FIELD EFFECT FIELD EFFECT
Terminal Form NO LEAD WIRE
Terminal Position UNSPECIFIED AXIAL
Base Number Matches 4 1
Rohs Code No
ECCN Code EAR99
HTS Code 8541.10.00.70
JEDEC-95 Code DO-7
JESD-609 Code e0
Knee Impedance-Max 155000 Ω
Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C
Terminal Finish TIN LEAD

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