JANHCA1N5299
vs
MS1N5299
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
COMPENSATED DEVICES INC
|
MICROSEMI CORP
|
Package Description |
HERMETIC SEALED, DIE-2
|
O-LALF-W2
|
Reach Compliance Code |
unknown
|
unknown
|
Case Connection |
CATHODE
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
CURRENT REGULATOR DIODE
|
CURRENT REGULATOR DIODE
|
JESD-30 Code |
S-XXUC-N2
|
O-LALF-W2
|
Limiting Voltage-Max |
1.45 V
|
1.45 V
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
UNSPECIFIED
|
GLASS
|
Package Shape |
SQUARE
|
ROUND
|
Package Style |
UNCASED CHIP
|
LONG FORM
|
Power Dissipation-Max |
0.5 W
|
0.475 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500/463G
|
|
Regulation Current-Nom (Ireg) |
1.2 mA
|
1.2 mA
|
Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
Surface Mount |
YES
|
NO
|
Technology |
FIELD EFFECT
|
FIELD EFFECT
|
Terminal Form |
NO LEAD
|
WIRE
|
Terminal Position |
UNSPECIFIED
|
AXIAL
|
Base Number Matches |
4
|
1
|
Rohs Code |
|
No
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8541.10.00.70
|
JEDEC-95 Code |
|
DO-7
|
JESD-609 Code |
|
e0
|
Knee Impedance-Max |
|
155000 Ω
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-55 °C
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare JANHCA1N5299 with alternatives
Compare MS1N5299 with alternatives