MS1N5299
vs
JAN1N5299-1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROSEMI CORP
KNOX SEMICONDUCTORS INC
Package Description
O-LALF-W2
GLASS PACKAGE-2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.70
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JEDEC-95 Code
DO-7
DO-7
JESD-30 Code
O-LALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Knee Impedance-Max
155000 Ω
Limiting Voltage-Max
1.45 V
1.45 V
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
Operating Temperature-Min
-55 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Power Dissipation-Max
0.475 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Regulation Current-Nom (Ireg)
1.2 mA
1.2 mA
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
NO
NO
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
1
9
Dynamic Impedance-Min
640000 Ω
Reference Standard
MIL-19500/463
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