JANHCA1N5295
vs
1N5295-1E3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Part Package Code
DIE
DO-7
Package Description
HERMETIC SEALED, DIE-2
ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.40
8541.10.00.70
Case Connection
CATHODE
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
CURRENT REGULATOR DIODE
CURRENT REGULATOR DIODE
JESD-30 Code
S-XXUC-N2
O-LALF-W2
JESD-609 Code
e0
Limiting Voltage-Max
1.25 V
1.25 V
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
UNSPECIFIED
GLASS
Package Shape
SQUARE
ROUND
Package Style
UNCASED CHIP
LONG FORM
Qualification Status
Not Qualified
Reference Standard
MIL-19500/463G
Regulation Current-Nom (Ireg)
0.82 mA
0.82 mA
Surface Mount
YES
NO
Technology
FIELD EFFECT
FIELD EFFECT
Terminal Finish
Tin/Lead (Sn/Pb)
PURE MATTE TIN
Terminal Form
NO LEAD
WIRE
Terminal Position
UNSPECIFIED
AXIAL
Base Number Matches
4
1
Pbfree Code
Additional Feature
METALLURGICALLY BONDED, HIGH SOURCE IMPEDANCE
Dynamic Impedance-Min
1000000 Ω
JEDEC-95 Code
DO-7
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Power Dissipation-Max
0.5 W
Rep Pk Reverse Voltage-Max
100 V
Compare JANHCA1N5295 with alternatives
Compare 1N5295-1E3 with alternatives