JANHCA1N4123
vs
JANHCA1N4123C
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIE
|
|
| Package Description |
DIE-2
|
DIE-2
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
METALLURGICALLY BONDED
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
S-XXUC-N2
|
S-XXUC-N2
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Reference Standard |
MIL-19500/435F
|
MIL-19500/435F
|
| Reference Voltage-Nom |
39 V
|
39 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UNSPECIFIED
|
UNSPECIFIED
|
| Voltage Tol-Max |
5%
|
2%
|
| Working Test Current |
0.25 mA
|
0.25 mA
|
| Base Number Matches |
3
|
1
|
| Dynamic Impedance-Max |
|
200 Ω
|
| Operating Temperature-Max |
|
200 °C
|
| Power Dissipation-Max |
|
0.25 W
|
|
|
|
Compare JANHCA1N4123 with alternatives
Compare JANHCA1N4123C with alternatives