JAN1N5822
vs
JAN1N5822
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
HERMETIC SEALED PACKAGE-2
HERMETIC SEALED PACKAGE-2
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.80
Samacsys Manufacturer
Microsemi Corporation
Additional Feature
METALLURGICALLY BONDED
METALLURGICALLY BONDED
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JESD-30 Code
O-XALF-W2
O-XALF-W2
JESD-609 Code
e0
e0
Non-rep Pk Forward Current-Max
80 A
80 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Output Current-Max
3 A
3 A
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Qualification Status
Not Qualified
Qualified
Reference Standard
MIL-19500/620E
MIL-19500/620E
Surface Mount
NO
NO
Technology
SCHOTTKY
SCHOTTKY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Base Number Matches
3
2
Factory Lead Time
24 Weeks
Compare JAN1N5822 with alternatives
Compare JAN1N5822 with alternatives