JAN1N4370AUR-1
vs
MMSZ5221BT1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ONSEMI
Package Description
MELF-2
PLASTIC, CASE 425-04, 2 PIN
Reach Compliance Code
compliant
not_compliant
Factory Lead Time
20 Weeks
4 Weeks
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
30 Ω
30 Ω
JEDEC-95 Code
DO-213AA
JESD-30 Code
O-LELF-R2
R-PDSO-G2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
150 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
RECTANGULAR
Package Style
LONG FORM
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Qualified
Not Qualified
Reference Standard
MIL-19500
Reference Voltage-Nom
2.4 V
2.4 V
Reverse Current-Max
100 µA
Reverse Test Voltage
1 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
WRAP AROUND
GULL WING
Terminal Position
END
DUAL
Voltage Temp Coeff-Max
-2.04 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
20 mA
20 mA
Base Number Matches
1
3
Pin Count
2
Manufacturer Package Code
CASE 425-04
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
onsemi
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
235
Compare JAN1N4370AUR-1 with alternatives
Compare MMSZ5221BT1 with alternatives